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C17300 Copper vs. C96400 Copper-nickel

Both C17300 copper and C96400 copper-nickel are copper alloys. They have 68% of their average alloy composition in common. There are 27 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C17300 copper and the bottom bar is C96400 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
140
Elongation at Break, % 3.0 to 23
25
Poisson's Ratio 0.33
0.33
Shear Modulus, GPa 45
51
Tensile Strength: Ultimate (UTS), MPa 500 to 1380
490
Tensile Strength: Yield (Proof), MPa 160 to 1200
260

Thermal Properties

Latent Heat of Fusion, J/g 230
240
Maximum Temperature: Mechanical, °C 270
260
Melting Completion (Liquidus), °C 980
1240
Melting Onset (Solidus), °C 870
1170
Specific Heat Capacity, J/kg-K 380
400
Thermal Conductivity, W/m-K 110
28
Thermal Expansion, µm/m-K 17
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22
5.0
Electrical Conductivity: Equal Weight (Specific), % IACS 23
5.1

Otherwise Unclassified Properties

Density, g/cm3 8.8
8.9
Embodied Carbon, kg CO2/kg material 9.4
5.9
Embodied Energy, MJ/kg 150
87
Embodied Water, L/kg 310
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 40 to 88
100
Resilience: Unit (Modulus of Resilience), kJ/m3 110 to 5410
250
Stiffness to Weight: Axial, points 7.6
8.6
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 16 to 44
15
Strength to Weight: Bending, points 16 to 31
16
Thermal Diffusivity, mm2/s 32
7.8
Thermal Shock Resistance, points 17 to 48
17

Alloy Composition

Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 1.8 to 2.0
0
Carbon (C), % 0
0 to 0.15
Copper (Cu), % 95.5 to 97.8
62.3 to 71.3
Iron (Fe), % 0 to 0.4
0.25 to 1.5
Lead (Pb), % 0.2 to 0.6
0 to 0.010
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0.2 to 0.6
28 to 32
Niobium (Nb), % 0
0.5 to 1.5
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0 to 0.2
0 to 0.5
Sulfur (S), % 0
0 to 0.020
Residuals, % 0
0 to 0.5