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C17500 Copper vs. C82400 Copper

Both C17500 copper and C82400 copper are copper alloys. They have a very high 98% of their average alloy composition in common. There are 27 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C17500 copper and the bottom bar is C82400 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 6.0 to 30
1.0 to 20
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 45
45
Tensile Strength: Ultimate (UTS), MPa 310 to 860
500 to 1030
Tensile Strength: Yield (Proof), MPa 170 to 760
260 to 970

Thermal Properties

Latent Heat of Fusion, J/g 220
230
Maximum Temperature: Mechanical, °C 220
270
Melting Completion (Liquidus), °C 1060
1000
Melting Onset (Solidus), °C 1020
900
Specific Heat Capacity, J/kg-K 390
380
Thermal Conductivity, W/m-K 200
130
Thermal Expansion, µm/m-K 18
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 24 to 53
25
Electrical Conductivity: Equal Weight (Specific), % IACS 24 to 54
26

Otherwise Unclassified Properties

Density, g/cm3 8.9
8.8
Embodied Carbon, kg CO2/kg material 4.7
8.9
Embodied Energy, MJ/kg 73
140
Embodied Water, L/kg 320
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 30 to 120
10 to 83
Resilience: Unit (Modulus of Resilience), kJ/m3 120 to 2390
270 to 3870
Stiffness to Weight: Axial, points 7.5
7.6
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 9.7 to 27
16 to 33
Strength to Weight: Bending, points 11 to 23
16 to 26
Thermal Diffusivity, mm2/s 59
39
Thermal Shock Resistance, points 11 to 29
17 to 36

Alloy Composition

Aluminum (Al), % 0 to 0.2
0 to 0.15
Beryllium (Be), % 0.4 to 0.7
1.6 to 1.9
Chromium (Cr), % 0
0 to 0.1
Cobalt (Co), % 2.4 to 2.7
0.2 to 0.65
Copper (Cu), % 95.6 to 97.2
96 to 98.2
Iron (Fe), % 0 to 0.1
0 to 0.2
Lead (Pb), % 0
0 to 0.020
Nickel (Ni), % 0
0 to 0.2
Silicon (Si), % 0 to 0.2
0
Tin (Sn), % 0
0 to 0.1
Titanium (Ti), % 0
0 to 0.12
Zinc (Zn), % 0
0 to 0.1
Residuals, % 0
0 to 0.5