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C17500 Copper vs. C96200 Copper-nickel

Both C17500 copper and C96200 copper-nickel are copper alloys. They have 87% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C17500 copper and the bottom bar is C96200 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 6.0 to 30
23
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 45
46
Tensile Strength: Ultimate (UTS), MPa 310 to 860
350
Tensile Strength: Yield (Proof), MPa 170 to 760
190

Thermal Properties

Latent Heat of Fusion, J/g 220
220
Maximum Temperature: Mechanical, °C 220
220
Melting Completion (Liquidus), °C 1060
1150
Melting Onset (Solidus), °C 1020
1100
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 200
45
Thermal Expansion, µm/m-K 18
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 24 to 53
11
Electrical Conductivity: Equal Weight (Specific), % IACS 24 to 54
11

Otherwise Unclassified Properties

Base Metal Price, % relative 60
36
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 4.7
3.8
Embodied Energy, MJ/kg 73
58
Embodied Water, L/kg 320
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 30 to 120
68
Resilience: Unit (Modulus of Resilience), kJ/m3 120 to 2390
150
Stiffness to Weight: Axial, points 7.5
7.8
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 9.7 to 27
11
Strength to Weight: Bending, points 11 to 23
13
Thermal Diffusivity, mm2/s 59
13
Thermal Shock Resistance, points 11 to 29
12

Alloy Composition

Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 0.4 to 0.7
0
Carbon (C), % 0
0 to 0.1
Cobalt (Co), % 2.4 to 2.7
0
Copper (Cu), % 95.6 to 97.2
83.6 to 90
Iron (Fe), % 0 to 0.1
1.0 to 1.8
Lead (Pb), % 0
0 to 0.010
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0
9.0 to 11
Niobium (Nb), % 0
0 to 1.0
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0 to 0.2
0 to 0.5
Sulfur (S), % 0
0 to 0.020
Residuals, % 0
0 to 0.5