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C17510 Copper vs. C16500 Copper

Both C17510 copper and C16500 copper are copper alloys. They have a very high 97% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C17510 copper and the bottom bar is C16500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
110
Elongation at Break, % 5.4 to 37
1.5 to 53
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 44
43
Shear Strength, MPa 210 to 500
200 to 310
Tensile Strength: Ultimate (UTS), MPa 310 to 860
280 to 530
Tensile Strength: Yield (Proof), MPa 120 to 750
97 to 520

Thermal Properties

Latent Heat of Fusion, J/g 220
210
Maximum Temperature: Mechanical, °C 220
340
Melting Completion (Liquidus), °C 1070
1070
Melting Onset (Solidus), °C 1030
1010
Specific Heat Capacity, J/kg-K 390
380
Thermal Conductivity, W/m-K 210
250
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 22 to 54
60
Electrical Conductivity: Equal Weight (Specific), % IACS 23 to 54
61

Otherwise Unclassified Properties

Base Metal Price, % relative 49
31
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 4.2
2.6
Embodied Energy, MJ/kg 65
42
Embodied Water, L/kg 310
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 39 to 92
7.8 to 110
Resilience: Unit (Modulus of Resilience), kJ/m3 64 to 2410
41 to 1160
Stiffness to Weight: Axial, points 7.4
7.1
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 9.7 to 27
8.6 to 17
Strength to Weight: Bending, points 11 to 23
11 to 16
Thermal Diffusivity, mm2/s 60
74
Thermal Shock Resistance, points 11 to 30
9.8 to 19

Alloy Composition

Aluminum (Al), % 0 to 0.2
0
Beryllium (Be), % 0.2 to 0.6
0
Cadmium (Cd), % 0
0.6 to 1.0
Cobalt (Co), % 0 to 0.3
0
Copper (Cu), % 95.9 to 98.4
97.8 to 98.9
Iron (Fe), % 0 to 0.1
0 to 0.020
Nickel (Ni), % 1.4 to 2.2
0
Silicon (Si), % 0 to 0.2
0
Tin (Sn), % 0
0.5 to 0.7
Residuals, % 0
0 to 0.5