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C18900 Copper vs. C74500 Nickel Silver

Both C18900 copper and C74500 nickel silver are copper alloys. They have 66% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C18900 copper and the bottom bar is C74500 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 14 to 48
3.0 to 24
Poisson's Ratio 0.34
0.32
Shear Modulus, GPa 43
44
Shear Strength, MPa 190 to 300
310 to 380
Tensile Strength: Ultimate (UTS), MPa 260 to 500
390 to 700
Tensile Strength: Yield (Proof), MPa 67 to 390
380 to 600

Thermal Properties

Latent Heat of Fusion, J/g 210
190
Maximum Temperature: Mechanical, °C 200
170
Melting Completion (Liquidus), °C 1080
1020
Melting Onset (Solidus), °C 1020
970
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 130
45
Thermal Expansion, µm/m-K 17
19

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 30
9.0
Electrical Conductivity: Equal Weight (Specific), % IACS 30
9.7

Otherwise Unclassified Properties

Base Metal Price, % relative 31
29
Density, g/cm3 8.9
8.3
Embodied Carbon, kg CO2/kg material 2.7
3.4
Embodied Energy, MJ/kg 42
54
Embodied Water, L/kg 310
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 65 to 95
12 to 160
Resilience: Unit (Modulus of Resilience), kJ/m3 20 to 660
620 to 1540
Stiffness to Weight: Axial, points 7.2
7.7
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 8.2 to 16
13 to 23
Strength to Weight: Bending, points 10 to 16
14 to 21
Thermal Diffusivity, mm2/s 38
14
Thermal Shock Resistance, points 9.3 to 18
13 to 23

Alloy Composition

Aluminum (Al), % 0 to 0.010
0
Copper (Cu), % 97.7 to 99.15
63.5 to 66.5
Iron (Fe), % 0
0 to 0.25
Lead (Pb), % 0 to 0.020
0 to 0.1
Manganese (Mn), % 0.1 to 0.3
0 to 0.5
Nickel (Ni), % 0
9.0 to 11
Phosphorus (P), % 0 to 0.050
0
Silicon (Si), % 0.15 to 0.4
0
Tin (Sn), % 0.6 to 0.9
0
Zinc (Zn), % 0 to 0.1
21.2 to 27.5
Residuals, % 0
0 to 0.5

Comparable Variants