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C19000 Copper vs. Solder Alloy 123

C19000 copper belongs to the copper alloys classification, while solder alloy 123 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C19000 copper and the bottom bar is solder alloy 123.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
18
Elongation at Break, % 2.5 to 50
45
Poisson's Ratio 0.34
0.44
Shear Modulus, GPa 43
6.2
Tensile Strength: Ultimate (UTS), MPa 260 to 760
28

Thermal Properties

Latent Heat of Fusion, J/g 210
26
Melting Completion (Liquidus), °C 1080
310
Melting Onset (Solidus), °C 1040
300
Specific Heat Capacity, J/kg-K 390
130
Thermal Conductivity, W/m-K 250
23
Thermal Expansion, µm/m-K 17
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 60
8.8
Electrical Conductivity: Equal Weight (Specific), % IACS 61
7.1

Otherwise Unclassified Properties

Base Metal Price, % relative 31
75
Density, g/cm3 8.9
11
Embodied Carbon, kg CO2/kg material 2.7
4.5
Embodied Energy, MJ/kg 42
74
Embodied Water, L/kg 310
500

Common Calculations

Stiffness to Weight: Axial, points 7.2
0.9
Stiffness to Weight: Bending, points 18
7.8
Strength to Weight: Axial, points 8.2 to 24
0.69
Strength to Weight: Bending, points 10 to 21
1.8
Thermal Diffusivity, mm2/s 73
16
Thermal Shock Resistance, points 9.3 to 27
3.8

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 96.9 to 99
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.1
0 to 0.020
Lead (Pb), % 0 to 0.050
93.5 to 95.5
Nickel (Ni), % 0.9 to 1.3
0 to 0.010
Phosphorus (P), % 0.15 to 0.35
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
4.5 to 5.5
Zinc (Zn), % 0 to 0.8
0 to 0.0010
Residuals, % 0 to 0.5
0