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C19000 Copper vs. Solder Alloy 801

C19000 copper belongs to the copper alloys classification, while solder alloy 801 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C19000 copper and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
53
Elongation at Break, % 2.5 to 50
33
Poisson's Ratio 0.34
0.35
Shear Modulus, GPa 43
20
Tensile Strength: Ultimate (UTS), MPa 260 to 760
55

Thermal Properties

Latent Heat of Fusion, J/g 210
64
Melting Completion (Liquidus), °C 1080
200
Melting Onset (Solidus), °C 1040
200
Specific Heat Capacity, J/kg-K 390
240
Thermal Conductivity, W/m-K 250
61
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 60
15
Electrical Conductivity: Equal Weight (Specific), % IACS 61
19

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.2
Embodied Carbon, kg CO2/kg material 2.7
14
Embodied Energy, MJ/kg 42
240
Embodied Water, L/kg 310
1140

Common Calculations

Stiffness to Weight: Axial, points 7.2
4.1
Stiffness to Weight: Bending, points 18
17
Strength to Weight: Axial, points 8.2 to 24
2.1
Strength to Weight: Bending, points 10 to 21
4.4
Thermal Diffusivity, mm2/s 73
36
Thermal Shock Resistance, points 9.3 to 27
3.3

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 96.9 to 99
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.1
0 to 0.020
Lead (Pb), % 0 to 0.050
0 to 0.070
Nickel (Ni), % 0.9 to 1.3
0 to 0.010
Phosphorus (P), % 0.15 to 0.35
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
89.9 to 91.5
Zinc (Zn), % 0 to 0.8
8.5 to 9.5
Residuals, % 0 to 0.5
0