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C19010 Copper vs. Grade M30C Nickel

C19010 copper belongs to the copper alloys classification, while grade M30C nickel belongs to the nickel alloys. They have a modest 31% of their average alloy composition in common, which, by itself, doesn't mean much. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C19010 copper and the bottom bar is grade M30C nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
160
Elongation at Break, % 2.4 to 22
29
Poisson's Ratio 0.34
0.32
Shear Modulus, GPa 43
61
Tensile Strength: Ultimate (UTS), MPa 330 to 640
510
Tensile Strength: Yield (Proof), MPa 260 to 620
250

Thermal Properties

Latent Heat of Fusion, J/g 210
290
Maximum Temperature: Mechanical, °C 200
900
Melting Completion (Liquidus), °C 1060
1290
Melting Onset (Solidus), °C 1010
1240
Specific Heat Capacity, J/kg-K 390
430
Thermal Conductivity, W/m-K 260
22
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 48 to 63
3.3
Electrical Conductivity: Equal Weight (Specific), % IACS 48 to 63
3.4

Otherwise Unclassified Properties

Base Metal Price, % relative 31
60
Density, g/cm3 8.9
8.8
Embodied Carbon, kg CO2/kg material 2.7
9.5
Embodied Energy, MJ/kg 42
140
Embodied Water, L/kg 310
250

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 7.3 to 140
120
Resilience: Unit (Modulus of Resilience), kJ/m3 290 to 1680
200
Stiffness to Weight: Axial, points 7.3
10
Stiffness to Weight: Bending, points 18
21
Strength to Weight: Axial, points 10 to 20
16
Strength to Weight: Bending, points 12 to 18
16
Thermal Diffusivity, mm2/s 75
5.7
Thermal Shock Resistance, points 12 to 23
18

Alloy Composition

Carbon (C), % 0
0 to 0.3
Copper (Cu), % 97.3 to 99.04
26 to 33
Iron (Fe), % 0
0 to 3.5
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0.8 to 1.8
56.6 to 72
Niobium (Nb), % 0
1.0 to 3.0
Phosphorus (P), % 0.010 to 0.050
0 to 0.030
Silicon (Si), % 0.15 to 0.35
1.0 to 2.0
Sulfur (S), % 0
0 to 0.030
Residuals, % 0 to 0.5
0