C19020 Copper vs. Nickel 689
C19020 copper belongs to the copper alloys classification, while nickel 689 belongs to the nickel alloys. There are 22 material properties with values for both materials. Properties with values for just one material (10, in this case) are not shown.
For each property being compared, the top bar is C19020 copper and the bottom bar is nickel 689.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 120 | |
| 210 |
| Elongation at Break, % | 2.3 to 5.7 | |
| 23 |
| Poisson's Ratio | 0.34 | |
| 0.29 |
| Shear Modulus, GPa | 44 | |
| 80 |
| Shear Strength, MPa | 260 to 340 | |
| 790 |
| Tensile Strength: Ultimate (UTS), MPa | 440 to 590 | |
| 1250 |
Thermal Properties
| Latent Heat of Fusion, J/g | 210 | |
| 330 |
| Maximum Temperature: Mechanical, °C | 200 | |
| 990 |
| Melting Completion (Liquidus), °C | 1090 | |
| 1440 |
| Melting Onset (Solidus), °C | 1030 | |
| 1390 |
| Specific Heat Capacity, J/kg-K | 390 | |
| 450 |
| Thermal Expansion, µm/m-K | 17 | |
| 12 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 31 | |
| 70 |
| Density, g/cm3 | 8.9 | |
| 8.5 |
| Embodied Carbon, kg CO2/kg material | 2.8 | |
| 11 |
| Embodied Energy, MJ/kg | 44 | |
| 150 |
| Embodied Water, L/kg | 310 | |
| 330 |
Common Calculations
| Stiffness to Weight: Axial, points | 7.2 | |
| 14 |
| Stiffness to Weight: Bending, points | 18 | |
| 23 |
| Strength to Weight: Axial, points | 14 to 18 | |
| 41 |
| Strength to Weight: Bending, points | 14 to 18 | |
| 30 |
| Thermal Shock Resistance, points | 16 to 21 | |
| 35 |
Alloy Composition
| Aluminum (Al), % | 0 | |
| 0.75 to 1.3 |
| Boron (B), % | 0 | |
| 0.0030 to 0.010 |
| Carbon (C), % | 0 | |
| 0.1 to 0.2 |
| Chromium (Cr), % | 0 | |
| 18 to 20 |
| Cobalt (Co), % | 0 | |
| 9.0 to 11 |
| Copper (Cu), % | 95.7 to 99.19 | |
| 0 |
| Iron (Fe), % | 0 | |
| 0 to 5.0 |
| Manganese (Mn), % | 0 | |
| 0 to 0.5 |
| Molybdenum (Mo), % | 0 | |
| 9.0 to 10.5 |
| Nickel (Ni), % | 0.5 to 3.0 | |
| 48.3 to 60.9 |
| Phosphorus (P), % | 0.010 to 0.2 | |
| 0 to 0.015 |
| Silicon (Si), % | 0 | |
| 0 to 0.5 |
| Sulfur (S), % | 0 | |
| 0 to 0.015 |
| Tin (Sn), % | 0.3 to 0.9 | |
| 0 |
| Titanium (Ti), % | 0 | |
| 2.3 to 2.8 |
| Residuals, % | 0 to 0.2 | |
| 0 |