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C19025 Copper vs. Solder Alloy 151

C19025 copper belongs to the copper alloys classification, while solder alloy 151 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C19025 copper and the bottom bar is solder alloy 151.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
39
Elongation at Break, % 8.0 to 17
37
Poisson's Ratio 0.34
0.37
Shear Modulus, GPa 43
14
Tensile Strength: Ultimate (UTS), MPa 480 to 620
46

Thermal Properties

Latent Heat of Fusion, J/g 210
47
Melting Completion (Liquidus), °C 1080
150
Melting Onset (Solidus), °C 1020
150
Specific Heat Capacity, J/kg-K 380
190
Thermal Conductivity, W/m-K 160
44
Thermal Expansion, µm/m-K 17
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 40
10
Electrical Conductivity: Equal Weight (Specific), % IACS 40
10

Otherwise Unclassified Properties

Density, g/cm3 8.9
8.8
Embodied Carbon, kg CO2/kg material 2.8
9.2
Embodied Energy, MJ/kg 44
160
Embodied Water, L/kg 320
920

Common Calculations

Stiffness to Weight: Axial, points 7.2
2.5
Stiffness to Weight: Bending, points 18
13
Strength to Weight: Axial, points 15 to 19
1.4
Strength to Weight: Bending, points 15 to 18
3.2
Thermal Diffusivity, mm2/s 47
26
Thermal Shock Resistance, points 17 to 22
3.2

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
17.5 to 18.5
Copper (Cu), % 97.1 to 98.5
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
30.3 to 33
Nickel (Ni), % 0.8 to 1.2
0 to 0.010
Phosphorus (P), % 0.030 to 0.070
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0.7 to 1.1
49.5 to 50.5
Zinc (Zn), % 0 to 0.2
0 to 0.0010
Residuals, % 0 to 0.3
0