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C19100 Copper vs. Grade M30H Nickel

C19100 copper belongs to the copper alloys classification, while grade M30H nickel belongs to the nickel alloys. They have a modest 31% of their average alloy composition in common, which, by itself, doesn't mean much. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C19100 copper and the bottom bar is grade M30H nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
160
Elongation at Break, % 17 to 37
11
Poisson's Ratio 0.34
0.32
Shear Modulus, GPa 43
61
Tensile Strength: Ultimate (UTS), MPa 250 to 630
770
Tensile Strength: Yield (Proof), MPa 75 to 550
470

Thermal Properties

Latent Heat of Fusion, J/g 210
320
Maximum Temperature: Mechanical, °C 200
900
Melting Completion (Liquidus), °C 1080
1250
Melting Onset (Solidus), °C 1040
1200
Specific Heat Capacity, J/kg-K 390
440
Thermal Conductivity, W/m-K 250
22
Thermal Expansion, µm/m-K 17
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 55
3.3
Electrical Conductivity: Equal Weight (Specific), % IACS 56
3.4

Otherwise Unclassified Properties

Base Metal Price, % relative 33
50
Density, g/cm3 8.9
8.6
Embodied Carbon, kg CO2/kg material 2.7
7.7
Embodied Energy, MJ/kg 43
110
Embodied Water, L/kg 310
250

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 60 to 99
75
Resilience: Unit (Modulus of Resilience), kJ/m3 24 to 1310
700
Stiffness to Weight: Axial, points 7.2
10
Stiffness to Weight: Bending, points 18
21
Strength to Weight: Axial, points 7.7 to 20
25
Strength to Weight: Bending, points 9.9 to 18
22
Thermal Diffusivity, mm2/s 73
5.7
Thermal Shock Resistance, points 8.9 to 22
27

Alloy Composition

Carbon (C), % 0
0 to 0.3
Copper (Cu), % 96.5 to 98.6
27 to 33
Iron (Fe), % 0 to 0.2
0 to 3.5
Lead (Pb), % 0 to 0.1
0
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0.9 to 1.3
57.9 to 70.3
Phosphorus (P), % 0.15 to 0.35
0 to 0.030
Silicon (Si), % 0
2.7 to 3.7
Sulfur (S), % 0
0 to 0.030
Tellurium (Te), % 0.35 to 0.6
0
Zinc (Zn), % 0 to 0.5
0
Residuals, % 0 to 0.5
0