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C19200 Copper vs. Solder Alloy 102

C19200 copper belongs to the copper alloys classification, while solder alloy 102 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C19200 copper and the bottom bar is solder alloy 102.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
38
Elongation at Break, % 2.0 to 35
48
Poisson's Ratio 0.34
0.39
Shear Modulus, GPa 44
14
Tensile Strength: Ultimate (UTS), MPa 280 to 530
31

Thermal Properties

Latent Heat of Fusion, J/g 210
46
Melting Completion (Liquidus), °C 1080
180
Melting Onset (Solidus), °C 1080
180
Specific Heat Capacity, J/kg-K 390
190
Thermal Conductivity, W/m-K 240
53
Thermal Expansion, µm/m-K 17
25

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 58 to 74
12
Electrical Conductivity: Equal Weight (Specific), % IACS 58 to 75
13

Otherwise Unclassified Properties

Density, g/cm3 8.9
8.8
Embodied Carbon, kg CO2/kg material 2.6
11
Embodied Energy, MJ/kg 41
180
Embodied Water, L/kg 310
930

Common Calculations

Stiffness to Weight: Axial, points 7.2
2.4
Stiffness to Weight: Bending, points 18
13
Strength to Weight: Axial, points 8.8 to 17
1.0
Strength to Weight: Bending, points 11 to 16
2.5
Thermal Diffusivity, mm2/s 69
32
Thermal Shock Resistance, points 10 to 19
2.4

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.050
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.050
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 98.5 to 99.19
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.8 to 1.2
0 to 0.020
Lead (Pb), % 0 to 0.030
36 to 37.5
Nickel (Ni), % 0
0 to 0.010
Phosphorus (P), % 0.010 to 0.040
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
62.5 to 63.5
Zinc (Zn), % 0 to 0.2
0 to 0.0010
Residuals, % 0 to 0.2
0