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C19200 Copper vs. Solder Alloy 704

C19200 copper belongs to the copper alloys classification, while solder alloy 704 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is C19200 copper and the bottom bar is solder alloy 704.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
51
Elongation at Break, % 2.0 to 35
30
Poisson's Ratio 0.34
0.36
Shear Modulus, GPa 44
19
Tensile Strength: Ultimate (UTS), MPa 280 to 530
55

Thermal Properties

Latent Heat of Fusion, J/g 210
62
Melting Completion (Liquidus), °C 1080
240
Melting Onset (Solidus), °C 1080
220
Specific Heat Capacity, J/kg-K 390
220
Thermal Conductivity, W/m-K 240
50
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 58 to 74
13
Electrical Conductivity: Equal Weight (Specific), % IACS 58 to 75
15

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.5
Embodied Carbon, kg CO2/kg material 2.6
19
Embodied Energy, MJ/kg 41
320

Common Calculations

Stiffness to Weight: Axial, points 7.2
3.8
Stiffness to Weight: Bending, points 18
17
Strength to Weight: Axial, points 8.8 to 17
2.1
Strength to Weight: Bending, points 11 to 16
4.3
Thermal Diffusivity, mm2/s 69
30
Thermal Shock Resistance, points 10 to 19
3.5

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 98.5 to 99.19
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.8 to 1.2
0 to 0.020
Lead (Pb), % 0 to 0.030
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Phosphorus (P), % 0.010 to 0.040
0
Silver (Ag), % 0
4.8 to 5.2
Tin (Sn), % 0
94.3 to 95.2
Zinc (Zn), % 0 to 0.2
0 to 0.0010
Residuals, % 0 to 0.2
0