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C19200 Copper vs. C82800 Copper

Both C19200 copper and C82800 copper are copper alloys. They have a very high 96% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C19200 copper and the bottom bar is C82800 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 2.0 to 35
1.0 to 20
Poisson's Ratio 0.34
0.33
Rockwell B Hardness 38 to 76
45 to 85
Shear Modulus, GPa 44
46
Tensile Strength: Ultimate (UTS), MPa 280 to 530
670 to 1140
Tensile Strength: Yield (Proof), MPa 98 to 510
380 to 1000

Thermal Properties

Latent Heat of Fusion, J/g 210
240
Maximum Temperature: Mechanical, °C 200
310
Melting Completion (Liquidus), °C 1080
930
Melting Onset (Solidus), °C 1080
890
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 240
120
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 58 to 74
18
Electrical Conductivity: Equal Weight (Specific), % IACS 58 to 75
19

Otherwise Unclassified Properties

Density, g/cm3 8.9
8.7
Embodied Carbon, kg CO2/kg material 2.6
12
Embodied Energy, MJ/kg 41
190
Embodied Water, L/kg 310
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 10 to 98
11 to 110
Resilience: Unit (Modulus of Resilience), kJ/m3 42 to 1120
590 to 4080
Stiffness to Weight: Axial, points 7.2
7.8
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 8.8 to 17
21 to 36
Strength to Weight: Bending, points 11 to 16
20 to 28
Thermal Diffusivity, mm2/s 69
36
Thermal Shock Resistance, points 10 to 19
23 to 39

Alloy Composition

Aluminum (Al), % 0
0 to 0.15
Beryllium (Be), % 0
2.5 to 2.9
Chromium (Cr), % 0
0 to 0.1
Cobalt (Co), % 0
0.15 to 0.7
Copper (Cu), % 98.5 to 99.19
94.6 to 97.2
Iron (Fe), % 0.8 to 1.2
0 to 0.25
Lead (Pb), % 0 to 0.030
0 to 0.020
Nickel (Ni), % 0
0 to 0.2
Phosphorus (P), % 0.010 to 0.040
0
Silicon (Si), % 0
0.2 to 0.35
Tin (Sn), % 0
0 to 0.1
Titanium (Ti), % 0
0 to 0.12
Zinc (Zn), % 0 to 0.2
0 to 0.1
Residuals, % 0
0 to 0.5