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C19500 Copper vs. ASTM Grade HC Steel

C19500 copper belongs to the copper alloys classification, while ASTM grade HC steel belongs to the iron alloys. There are 28 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C19500 copper and the bottom bar is ASTM grade HC steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 2.3 to 38
6.0
Poisson's Ratio 0.34
0.27
Shear Modulus, GPa 44
80
Tensile Strength: Ultimate (UTS), MPa 380 to 640
430
Tensile Strength: Yield (Proof), MPa 120 to 600
200

Thermal Properties

Latent Heat of Fusion, J/g 210
310
Maximum Temperature: Mechanical, °C 200
1100
Melting Completion (Liquidus), °C 1090
1410
Melting Onset (Solidus), °C 1090
1370
Specific Heat Capacity, J/kg-K 390
490
Thermal Conductivity, W/m-K 200
17
Thermal Expansion, µm/m-K 17
11

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 50 to 56
2.2
Electrical Conductivity: Equal Weight (Specific), % IACS 50 to 57
2.6

Otherwise Unclassified Properties

Base Metal Price, % relative 31
14
Density, g/cm3 8.9
7.6
Embodied Carbon, kg CO2/kg material 2.7
2.8
Embodied Energy, MJ/kg 42
40
Embodied Water, L/kg 310
170

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 14 to 110
21
Resilience: Unit (Modulus of Resilience), kJ/m3 59 to 1530
95
Stiffness to Weight: Axial, points 7.3
15
Stiffness to Weight: Bending, points 18
26
Strength to Weight: Axial, points 12 to 20
16
Strength to Weight: Bending, points 13 to 18
16
Thermal Diffusivity, mm2/s 58
4.5
Thermal Shock Resistance, points 13 to 23
14

Alloy Composition

Aluminum (Al), % 0 to 0.020
0
Carbon (C), % 0
0 to 0.5
Chromium (Cr), % 0
26 to 30
Cobalt (Co), % 0.3 to 1.3
0
Copper (Cu), % 94.9 to 98.6
0
Iron (Fe), % 1.0 to 2.0
61.9 to 74
Lead (Pb), % 0 to 0.020
0
Manganese (Mn), % 0
0 to 1.0
Molybdenum (Mo), % 0
0 to 0.5
Nickel (Ni), % 0
0 to 4.0
Phosphorus (P), % 0.010 to 0.35
0 to 0.040
Silicon (Si), % 0
0 to 2.0
Sulfur (S), % 0
0 to 0.040
Tin (Sn), % 0.1 to 1.0
0
Zinc (Zn), % 0 to 0.2
0
Residuals, % 0 to 0.2
0