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C19700 Copper vs. CC751S Brass

Both C19700 copper and CC751S brass are copper alloys. They have 65% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C19700 copper and the bottom bar is CC751S brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
110
Elongation at Break, % 2.4 to 13
5.6
Poisson's Ratio 0.34
0.31
Shear Modulus, GPa 43
40
Tensile Strength: Ultimate (UTS), MPa 400 to 530
450
Tensile Strength: Yield (Proof), MPa 330 to 520
320

Thermal Properties

Latent Heat of Fusion, J/g 210
190
Maximum Temperature: Mechanical, °C 200
130
Melting Completion (Liquidus), °C 1090
850
Melting Onset (Solidus), °C 1040
810
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 250
110
Thermal Expansion, µm/m-K 17
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 86 to 88
25
Electrical Conductivity: Equal Weight (Specific), % IACS 87 to 89
28

Otherwise Unclassified Properties

Base Metal Price, % relative 30
24
Density, g/cm3 8.9
8.1
Embodied Carbon, kg CO2/kg material 2.6
2.8
Embodied Energy, MJ/kg 41
46
Embodied Water, L/kg 310
330

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 12 to 49
23
Resilience: Unit (Modulus of Resilience), kJ/m3 460 to 1160
480
Stiffness to Weight: Axial, points 7.2
7.2
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 12 to 16
15
Strength to Weight: Bending, points 14 to 16
16
Thermal Diffusivity, mm2/s 73
35
Thermal Shock Resistance, points 14 to 19
15

Alloy Composition

Aluminum (Al), % 0
0 to 0.1
Antimony (Sb), % 0
0 to 0.5
Cobalt (Co), % 0 to 0.050
0
Copper (Cu), % 97.4 to 99.59
62.7 to 66
Iron (Fe), % 0.3 to 1.2
0.25 to 0.5
Lead (Pb), % 0 to 0.050
0.8 to 2.2
Magnesium (Mg), % 0.010 to 0.2
0
Manganese (Mn), % 0 to 0.050
0 to 0.15
Nickel (Ni), % 0 to 0.050
0 to 0.8
Phosphorus (P), % 0.1 to 0.4
0
Silicon (Si), % 0
0.65 to 1.1
Tin (Sn), % 0 to 0.2
0 to 0.8
Zinc (Zn), % 0 to 0.2
27.9 to 35.6
Residuals, % 0 to 0.2
0