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C19800 Copper vs. CC383H Copper-nickel

Both C19800 copper and CC383H copper-nickel are copper alloys. They have 67% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C19800 copper and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
140
Elongation at Break, % 9.0 to 12
20
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 43
52
Tensile Strength: Ultimate (UTS), MPa 430 to 550
490
Tensile Strength: Yield (Proof), MPa 420 to 550
260

Thermal Properties

Latent Heat of Fusion, J/g 210
240
Maximum Temperature: Mechanical, °C 200
260
Melting Completion (Liquidus), °C 1070
1180
Melting Onset (Solidus), °C 1050
1130
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 260
29
Thermal Expansion, µm/m-K 18
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 61
5.2
Electrical Conductivity: Equal Weight (Specific), % IACS 62
5.3

Otherwise Unclassified Properties

Base Metal Price, % relative 30
44
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 2.8
5.7
Embodied Energy, MJ/kg 43
83
Embodied Water, L/kg 320
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 49 to 52
84
Resilience: Unit (Modulus of Resilience), kJ/m3 770 to 1320
250
Stiffness to Weight: Axial, points 7.2
8.6
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 14 to 17
15
Strength to Weight: Bending, points 14 to 17
16
Thermal Diffusivity, mm2/s 75
8.1
Thermal Shock Resistance, points 15 to 20
17

Alloy Composition

Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0
0 to 0.020
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 95.7 to 99.47
64 to 69.1
Iron (Fe), % 0.020 to 0.5
0.5 to 1.5
Lead (Pb), % 0
0 to 0.010
Magnesium (Mg), % 0.1 to 1.0
0 to 0.010
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 0
29 to 31
Niobium (Nb), % 0
0.5 to 1.0
Phosphorus (P), % 0.010 to 0.1
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0
0.3 to 0.7
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Tin (Sn), % 0.1 to 1.0
0
Zinc (Zn), % 0.3 to 1.5
0 to 0.5
Residuals, % 0 to 0.2
0