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C19800 Copper vs. Solder Alloy 112

C19800 copper belongs to the copper alloys classification, while solder alloy 112 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C19800 copper and the bottom bar is solder alloy 112.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
33
Elongation at Break, % 9.0 to 12
35
Poisson's Ratio 0.34
0.4
Shear Modulus, GPa 43
12
Tensile Strength: Ultimate (UTS), MPa 430 to 550
41

Thermal Properties

Latent Heat of Fusion, J/g 210
41
Melting Completion (Liquidus), °C 1070
220
Melting Onset (Solidus), °C 1050
180
Specific Heat Capacity, J/kg-K 390
180
Thermal Conductivity, W/m-K 260
49
Thermal Expansion, µm/m-K 18
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 61
11
Electrical Conductivity: Equal Weight (Specific), % IACS 62
10

Otherwise Unclassified Properties

Density, g/cm3 8.9
9.3
Embodied Carbon, kg CO2/kg material 2.8
9.4
Embodied Energy, MJ/kg 43
160
Embodied Water, L/kg 320
830

Common Calculations

Stiffness to Weight: Axial, points 7.2
2.0
Stiffness to Weight: Bending, points 18
11
Strength to Weight: Axial, points 14 to 17
1.2
Strength to Weight: Bending, points 14 to 17
2.8
Thermal Diffusivity, mm2/s 75
30
Thermal Shock Resistance, points 15 to 20
3.5

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.050
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.050
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 95.7 to 99.47
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.020 to 0.5
0 to 0.020
Lead (Pb), % 0
49 to 50.5
Magnesium (Mg), % 0.1 to 1.0
0
Nickel (Ni), % 0
0 to 0.010
Phosphorus (P), % 0.010 to 0.1
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0.1 to 1.0
49.5 to 50.5
Zinc (Zn), % 0.3 to 1.5
0 to 0.0010
Residuals, % 0 to 0.2
0