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C19800 Copper vs. Solder Alloy 704

C19800 copper belongs to the copper alloys classification, while solder alloy 704 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C19800 copper and the bottom bar is solder alloy 704.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
51
Elongation at Break, % 9.0 to 12
30
Poisson's Ratio 0.34
0.36
Shear Modulus, GPa 43
19
Tensile Strength: Ultimate (UTS), MPa 430 to 550
55

Thermal Properties

Latent Heat of Fusion, J/g 210
62
Melting Completion (Liquidus), °C 1070
240
Melting Onset (Solidus), °C 1050
220
Specific Heat Capacity, J/kg-K 390
220
Thermal Conductivity, W/m-K 260
50
Thermal Expansion, µm/m-K 18
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 61
13
Electrical Conductivity: Equal Weight (Specific), % IACS 62
15

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.5
Embodied Carbon, kg CO2/kg material 2.8
19
Embodied Energy, MJ/kg 43
320

Common Calculations

Stiffness to Weight: Axial, points 7.2
3.8
Stiffness to Weight: Bending, points 18
17
Strength to Weight: Axial, points 14 to 17
2.1
Strength to Weight: Bending, points 14 to 17
4.3
Thermal Diffusivity, mm2/s 75
30
Thermal Shock Resistance, points 15 to 20
3.5

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 95.7 to 99.47
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.020 to 0.5
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Magnesium (Mg), % 0.1 to 1.0
0
Nickel (Ni), % 0
0 to 0.010
Phosphorus (P), % 0.010 to 0.1
0
Silver (Ag), % 0
4.8 to 5.2
Tin (Sn), % 0.1 to 1.0
94.3 to 95.2
Zinc (Zn), % 0.3 to 1.5
0 to 0.0010
Residuals, % 0 to 0.2
0