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C26200 Brass vs. CC382H Copper-nickel

Both C26200 brass and CC382H copper-nickel are copper alloys. They have 66% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C26200 brass and the bottom bar is CC382H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
140
Elongation at Break, % 3.0 to 180
20
Poisson's Ratio 0.31
0.33
Shear Modulus, GPa 41
53
Tensile Strength: Ultimate (UTS), MPa 330 to 770
490
Tensile Strength: Yield (Proof), MPa 110 to 490
290

Thermal Properties

Latent Heat of Fusion, J/g 180
240
Maximum Temperature: Mechanical, °C 140
260
Melting Completion (Liquidus), °C 950
1180
Melting Onset (Solidus), °C 920
1120
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 120
30
Thermal Expansion, µm/m-K 20
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 28
5.5
Electrical Conductivity: Equal Weight (Specific), % IACS 31
5.6

Otherwise Unclassified Properties

Base Metal Price, % relative 25
41
Density, g/cm3 8.2
8.9
Embodied Carbon, kg CO2/kg material 2.7
5.2
Embodied Energy, MJ/kg 45
76
Embodied Water, L/kg 320
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 19 to 160
85
Resilience: Unit (Modulus of Resilience), kJ/m3 62 to 1110
290
Stiffness to Weight: Axial, points 7.2
8.8
Stiffness to Weight: Bending, points 19
20
Strength to Weight: Axial, points 11 to 26
15
Strength to Weight: Bending, points 13 to 23
16
Thermal Diffusivity, mm2/s 38
8.2
Thermal Shock Resistance, points 11 to 26
16

Alloy Composition

Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0
0 to 0.0020
Boron (B), % 0
0 to 0.010
Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0
1.5 to 2.0
Copper (Cu), % 67 to 70
62.8 to 68.4
Iron (Fe), % 0 to 0.050
0.5 to 1.0
Lead (Pb), % 0 to 0.070
0 to 0.0050
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.5 to 1.0
Nickel (Ni), % 0
29 to 32
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.0050
Silicon (Si), % 0
0.15 to 0.5
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.0050
Titanium (Ti), % 0
0 to 0.25
Zinc (Zn), % 29.6 to 33
0 to 0.2
Zirconium (Zr), % 0
0 to 0.15
Residuals, % 0 to 0.3
0