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C26200 Brass vs. Solder Alloy 111

C26200 brass belongs to the copper alloys classification, while solder alloy 111 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is C26200 brass and the bottom bar is solder alloy 111.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
33
Elongation at Break, % 3.0 to 180
35
Poisson's Ratio 0.31
0.4
Shear Modulus, GPa 41
12
Tensile Strength: Ultimate (UTS), MPa 330 to 770
41

Thermal Properties

Latent Heat of Fusion, J/g 180
41
Melting Completion (Liquidus), °C 950
220
Melting Onset (Solidus), °C 920
180
Specific Heat Capacity, J/kg-K 390
180
Thermal Conductivity, W/m-K 120
48
Thermal Expansion, µm/m-K 20
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 28
11
Electrical Conductivity: Equal Weight (Specific), % IACS 31
11

Otherwise Unclassified Properties

Density, g/cm3 8.2
9.3
Embodied Carbon, kg CO2/kg material 2.7
9.4
Embodied Energy, MJ/kg 45
160
Embodied Water, L/kg 320
830

Common Calculations

Stiffness to Weight: Axial, points 7.2
2.0
Stiffness to Weight: Bending, points 19
12
Strength to Weight: Axial, points 11 to 26
1.2
Strength to Weight: Bending, points 13 to 23
2.8
Thermal Diffusivity, mm2/s 38
29
Thermal Shock Resistance, points 11 to 26
3.5

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 67 to 70
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.050
0 to 0.020
Lead (Pb), % 0 to 0.070
48.8 to 50.5
Nickel (Ni), % 0
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
49.5 to 50.5
Zinc (Zn), % 29.6 to 33
0 to 0.0010
Residuals, % 0 to 0.3
0