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C26200 Brass vs. Solder Alloy 115

C26200 brass belongs to the copper alloys classification, while solder alloy 115 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C26200 brass and the bottom bar is solder alloy 115.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
28
Elongation at Break, % 3.0 to 180
22
Poisson's Ratio 0.31
0.41
Shear Modulus, GPa 41
10
Tensile Strength: Ultimate (UTS), MPa 330 to 770
36

Thermal Properties

Latent Heat of Fusion, J/g 180
36
Melting Completion (Liquidus), °C 950
250
Melting Onset (Solidus), °C 920
180
Specific Heat Capacity, J/kg-K 390
160
Thermal Conductivity, W/m-K 120
43
Thermal Expansion, µm/m-K 20
27

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 28
9.8
Electrical Conductivity: Equal Weight (Specific), % IACS 31
8.9

Otherwise Unclassified Properties

Base Metal Price, % relative 25
95
Density, g/cm3 8.2
9.9
Embodied Carbon, kg CO2/kg material 2.7
7.8
Embodied Energy, MJ/kg 45
130
Embodied Water, L/kg 320
730

Common Calculations

Stiffness to Weight: Axial, points 7.2
1.6
Stiffness to Weight: Bending, points 19
10
Strength to Weight: Axial, points 11 to 26
1.0
Strength to Weight: Bending, points 13 to 23
2.4
Thermal Diffusivity, mm2/s 38
27
Thermal Shock Resistance, points 11 to 26
3.4

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.25
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 67 to 70
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.050
0 to 0.020
Lead (Pb), % 0 to 0.070
63.4 to 65.5
Nickel (Ni), % 0
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
34.5 to 35.5
Zinc (Zn), % 29.6 to 33
0 to 0.0010
Residuals, % 0 to 0.3
0