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C26200 Brass vs. Solder Alloy 124

C26200 brass belongs to the copper alloys classification, while solder alloy 124 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C26200 brass and the bottom bar is solder alloy 124.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
17
Elongation at Break, % 3.0 to 180
46
Poisson's Ratio 0.31
0.44
Shear Modulus, GPa 41
5.8
Tensile Strength: Ultimate (UTS), MPa 330 to 770
27

Thermal Properties

Latent Heat of Fusion, J/g 180
24
Melting Completion (Liquidus), °C 950
330
Melting Onset (Solidus), °C 920
320
Specific Heat Capacity, J/kg-K 390
130
Thermal Conductivity, W/m-K 120
22
Thermal Expansion, µm/m-K 20
29

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 28
9.6
Electrical Conductivity: Equal Weight (Specific), % IACS 31
7.7

Otherwise Unclassified Properties

Base Metal Price, % relative 25
70
Density, g/cm3 8.2
11
Embodied Carbon, kg CO2/kg material 2.7
4.1
Embodied Energy, MJ/kg 45
68
Embodied Water, L/kg 320
470

Common Calculations

Stiffness to Weight: Axial, points 7.2
0.83
Stiffness to Weight: Bending, points 19
7.6
Strength to Weight: Axial, points 11 to 26
0.65
Strength to Weight: Bending, points 13 to 23
1.8
Thermal Diffusivity, mm2/s 38
15
Thermal Shock Resistance, points 11 to 26
3.9

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.12
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 67 to 70
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.050
0 to 0.020
Lead (Pb), % 0 to 0.070
97.2 to 98.2
Nickel (Ni), % 0
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
1.8 to 2.2
Zinc (Zn), % 29.6 to 33
0 to 0.0010
Residuals, % 0 to 0.3
0