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C26200 Brass vs. Solder Alloy 811

C26200 brass belongs to the copper alloys classification, while solder alloy 811 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C26200 brass and the bottom bar is solder alloy 811.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
52
Elongation at Break, % 3.0 to 180
38
Poisson's Ratio 0.31
0.35
Shear Modulus, GPa 41
19
Tensile Strength: Ultimate (UTS), MPa 330 to 770
53

Thermal Properties

Latent Heat of Fusion, J/g 180
63
Melting Completion (Liquidus), °C 950
200
Melting Onset (Solidus), °C 920
190
Specific Heat Capacity, J/kg-K 390
230
Thermal Conductivity, W/m-K 120
59
Thermal Expansion, µm/m-K 20
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 28
14
Electrical Conductivity: Equal Weight (Specific), % IACS 31
17

Otherwise Unclassified Properties

Density, g/cm3 8.2
7.3
Embodied Carbon, kg CO2/kg material 2.7
14
Embodied Energy, MJ/kg 45
240
Embodied Water, L/kg 320
1200

Common Calculations

Stiffness to Weight: Axial, points 7.2
4.0
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 11 to 26
2.0
Strength to Weight: Bending, points 13 to 23
4.3
Thermal Diffusivity, mm2/s 38
35
Thermal Shock Resistance, points 11 to 26
3.3

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
2.8 to 3.2
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 67 to 70
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.050
0 to 0.020
Lead (Pb), % 0 to 0.070
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
87.8 to 89.7
Zinc (Zn), % 29.6 to 33
7.5 to 8.5
Residuals, % 0 to 0.3
0