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C26200 Brass vs. C82000 Copper

Both C26200 brass and C82000 copper are copper alloys. They have 69% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C26200 brass and the bottom bar is C82000 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
120
Elongation at Break, % 3.0 to 180
8.0 to 20
Poisson's Ratio 0.31
0.34
Rockwell B Hardness 55 to 93
55 to 95
Shear Modulus, GPa 41
45
Tensile Strength: Ultimate (UTS), MPa 330 to 770
350 to 690
Tensile Strength: Yield (Proof), MPa 110 to 490
140 to 520

Thermal Properties

Latent Heat of Fusion, J/g 180
220
Maximum Temperature: Mechanical, °C 140
220
Melting Completion (Liquidus), °C 950
1090
Melting Onset (Solidus), °C 920
970
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 120
260
Thermal Expansion, µm/m-K 20
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 28
45
Electrical Conductivity: Equal Weight (Specific), % IACS 31
46

Otherwise Unclassified Properties

Base Metal Price, % relative 25
60
Density, g/cm3 8.2
8.9
Embodied Carbon, kg CO2/kg material 2.7
5.0
Embodied Energy, MJ/kg 45
77
Embodied Water, L/kg 320
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 19 to 160
51 to 55
Resilience: Unit (Modulus of Resilience), kJ/m3 62 to 1110
80 to 1120
Stiffness to Weight: Axial, points 7.2
7.5
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 11 to 26
11 to 22
Strength to Weight: Bending, points 13 to 23
12 to 20
Thermal Diffusivity, mm2/s 38
76
Thermal Shock Resistance, points 11 to 26
12 to 24

Alloy Composition

Aluminum (Al), % 0
0 to 0.1
Beryllium (Be), % 0
0.45 to 0.8
Chromium (Cr), % 0
0 to 0.1
Cobalt (Co), % 0
2.2 to 2.7
Copper (Cu), % 67 to 70
95.2 to 97.4
Iron (Fe), % 0 to 0.050
0 to 0.1
Lead (Pb), % 0 to 0.070
0 to 0.020
Nickel (Ni), % 0
0 to 0.2
Silicon (Si), % 0
0 to 0.15
Tin (Sn), % 0
0 to 0.1
Zinc (Zn), % 29.6 to 33
0 to 0.1
Residuals, % 0
0 to 0.5