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C28000 Muntz Metal vs. CC383H Copper-nickel

Both C28000 Muntz Metal and CC383H copper-nickel are copper alloys. They have 61% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C28000 Muntz Metal and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
140
Elongation at Break, % 10 to 45
20
Poisson's Ratio 0.31
0.33
Shear Modulus, GPa 40
52
Tensile Strength: Ultimate (UTS), MPa 330 to 610
490
Tensile Strength: Yield (Proof), MPa 150 to 370
260

Thermal Properties

Latent Heat of Fusion, J/g 170
240
Maximum Temperature: Mechanical, °C 120
260
Melting Completion (Liquidus), °C 900
1180
Melting Onset (Solidus), °C 900
1130
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 120
29
Thermal Expansion, µm/m-K 21
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 28
5.2
Electrical Conductivity: Equal Weight (Specific), % IACS 31
5.3

Otherwise Unclassified Properties

Base Metal Price, % relative 23
44
Density, g/cm3 8.0
8.9
Embodied Carbon, kg CO2/kg material 2.7
5.7
Embodied Energy, MJ/kg 46
83
Embodied Water, L/kg 320
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 27 to 240
84
Resilience: Unit (Modulus of Resilience), kJ/m3 110 to 670
250
Stiffness to Weight: Axial, points 7.2
8.6
Stiffness to Weight: Bending, points 20
19
Strength to Weight: Axial, points 11 to 21
15
Strength to Weight: Bending, points 13 to 20
16
Thermal Diffusivity, mm2/s 40
8.1
Thermal Shock Resistance, points 11 to 20
17

Alloy Composition

Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0
0 to 0.020
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 59 to 63
64 to 69.1
Iron (Fe), % 0 to 0.070
0.5 to 1.5
Lead (Pb), % 0 to 0.3
0 to 0.010
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 0
29 to 31
Niobium (Nb), % 0
0.5 to 1.0
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0
0.3 to 0.7
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Zinc (Zn), % 36.3 to 41
0 to 0.5
Residuals, % 0 to 0.3
0