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C33200 Brass vs. Solder Alloy 116

C33200 brass belongs to the copper alloys classification, while solder alloy 116 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C33200 brass and the bottom bar is solder alloy 116.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
26
Elongation at Break, % 7.0 to 60
18
Poisson's Ratio 0.31
0.42
Shear Modulus, GPa 40
9.3
Tensile Strength: Ultimate (UTS), MPa 320 to 520
34

Thermal Properties

Latent Heat of Fusion, J/g 170
34
Melting Completion (Liquidus), °C 930
260
Melting Onset (Solidus), °C 900
180
Specific Heat Capacity, J/kg-K 380
160
Thermal Conductivity, W/m-K 120
41
Thermal Expansion, µm/m-K 20
27

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 26
9.3
Electrical Conductivity: Equal Weight (Specific), % IACS 28
8.3

Otherwise Unclassified Properties

Base Metal Price, % relative 24
90
Density, g/cm3 8.2
10
Embodied Carbon, kg CO2/kg material 2.6
7.2
Embodied Energy, MJ/kg 44
120
Embodied Water, L/kg 320
690

Common Calculations

Stiffness to Weight: Axial, points 7.1
1.5
Stiffness to Weight: Bending, points 19
9.8
Strength to Weight: Axial, points 11 to 17
0.94
Strength to Weight: Bending, points 13 to 17
2.3
Thermal Diffusivity, mm2/s 37
26
Thermal Shock Resistance, points 11 to 17
3.4

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.25
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 65 to 68
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.070
0 to 0.020
Lead (Pb), % 1.5 to 2.5
68.4 to 70.5
Nickel (Ni), % 0
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
29.5 to 30.5
Zinc (Zn), % 29 to 33.5
0 to 0.0010
Residuals, % 0 to 0.4
0