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C33200 Brass vs. Solder Alloy 801

C33200 brass belongs to the copper alloys classification, while solder alloy 801 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C33200 brass and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
53
Elongation at Break, % 7.0 to 60
33
Poisson's Ratio 0.31
0.35
Shear Modulus, GPa 40
20
Tensile Strength: Ultimate (UTS), MPa 320 to 520
55

Thermal Properties

Latent Heat of Fusion, J/g 170
64
Melting Completion (Liquidus), °C 930
200
Melting Onset (Solidus), °C 900
200
Specific Heat Capacity, J/kg-K 380
240
Thermal Conductivity, W/m-K 120
61
Thermal Expansion, µm/m-K 20
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 26
15
Electrical Conductivity: Equal Weight (Specific), % IACS 28
19

Otherwise Unclassified Properties

Density, g/cm3 8.2
7.2
Embodied Carbon, kg CO2/kg material 2.6
14
Embodied Energy, MJ/kg 44
240
Embodied Water, L/kg 320
1140

Common Calculations

Stiffness to Weight: Axial, points 7.1
4.1
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 11 to 17
2.1
Strength to Weight: Bending, points 13 to 17
4.4
Thermal Diffusivity, mm2/s 37
36
Thermal Shock Resistance, points 11 to 17
3.3

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 65 to 68
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.070
0 to 0.020
Lead (Pb), % 1.5 to 2.5
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
89.9 to 91.5
Zinc (Zn), % 29 to 33.5
8.5 to 9.5
Residuals, % 0 to 0.4
0