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C33500 Brass vs. C82000 Copper

Both C33500 brass and C82000 copper are copper alloys. They have 64% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C33500 brass and the bottom bar is C82000 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
120
Elongation at Break, % 3.0 to 28
8.0 to 20
Poisson's Ratio 0.31
0.34
Rockwell B Hardness 53 to 91
55 to 95
Shear Modulus, GPa 40
45
Tensile Strength: Ultimate (UTS), MPa 340 to 650
350 to 690
Tensile Strength: Yield (Proof), MPa 120 to 420
140 to 520

Thermal Properties

Latent Heat of Fusion, J/g 170
220
Maximum Temperature: Mechanical, °C 120
220
Melting Completion (Liquidus), °C 930
1090
Melting Onset (Solidus), °C 900
970
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 120
260
Thermal Expansion, µm/m-K 20
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 26
45
Electrical Conductivity: Equal Weight (Specific), % IACS 29
46

Otherwise Unclassified Properties

Base Metal Price, % relative 24
60
Density, g/cm3 8.1
8.9
Embodied Carbon, kg CO2/kg material 2.7
5.0
Embodied Energy, MJ/kg 45
77
Embodied Water, L/kg 320
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 8.0 to 160
51 to 55
Resilience: Unit (Modulus of Resilience), kJ/m3 69 to 860
80 to 1120
Stiffness to Weight: Axial, points 7.2
7.5
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 12 to 22
11 to 22
Strength to Weight: Bending, points 13 to 21
12 to 20
Thermal Diffusivity, mm2/s 37
76
Thermal Shock Resistance, points 11 to 22
12 to 24

Alloy Composition

Aluminum (Al), % 0
0 to 0.1
Beryllium (Be), % 0
0.45 to 0.8
Chromium (Cr), % 0
0 to 0.1
Cobalt (Co), % 0
2.2 to 2.7
Copper (Cu), % 62 to 65
95.2 to 97.4
Iron (Fe), % 0 to 0.1
0 to 0.1
Lead (Pb), % 0.25 to 0.7
0 to 0.020
Nickel (Ni), % 0
0 to 0.2
Silicon (Si), % 0
0 to 0.15
Tin (Sn), % 0
0 to 0.1
Zinc (Zn), % 33.8 to 37.8
0 to 0.1
Residuals, % 0
0 to 0.5