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C55180 Copper vs. CC383H Copper-nickel

Both C55180 copper and CC383H copper-nickel are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 67% of their average alloy composition in common. There are 26 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C55180 copper and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
140
Elongation at Break, % 20
20
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 41
52
Tensile Strength: Ultimate (UTS), MPa 200
490
Tensile Strength: Yield (Proof), MPa 100
260

Thermal Properties

Latent Heat of Fusion, J/g 200
240
Maximum Temperature: Mechanical, °C 200
260
Melting Completion (Liquidus), °C 920
1180
Melting Onset (Solidus), °C 710
1130
Specific Heat Capacity, J/kg-K 400
410
Thermal Conductivity, W/m-K 200
29
Thermal Expansion, µm/m-K 17
15

Otherwise Unclassified Properties

Base Metal Price, % relative 29
44
Density, g/cm3 8.6
8.9
Embodied Carbon, kg CO2/kg material 2.5
5.7
Embodied Energy, MJ/kg 39
83
Embodied Water, L/kg 290
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 34
84
Resilience: Unit (Modulus of Resilience), kJ/m3 48
250
Stiffness to Weight: Axial, points 7.1
8.6
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 6.4
15
Strength to Weight: Bending, points 8.8
16
Thermal Diffusivity, mm2/s 56
8.1
Thermal Shock Resistance, points 7.9
17

Alloy Composition

Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0
0 to 0.020
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 94.7 to 95.2
64 to 69.1
Iron (Fe), % 0
0.5 to 1.5
Lead (Pb), % 0
0 to 0.010
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 0
29 to 31
Niobium (Nb), % 0
0.5 to 1.0
Phosphorus (P), % 4.8 to 5.2
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0
0.3 to 0.7
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Zinc (Zn), % 0
0 to 0.5
Residuals, % 0 to 0.15
0