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C55180 Copper vs. Solder Alloy 115

C55180 copper belongs to the copper alloys classification, while solder alloy 115 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C55180 copper and the bottom bar is solder alloy 115.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
28
Elongation at Break, % 20
22
Poisson's Ratio 0.34
0.41
Shear Modulus, GPa 41
10
Tensile Strength: Ultimate (UTS), MPa 200
36

Thermal Properties

Latent Heat of Fusion, J/g 200
36
Melting Completion (Liquidus), °C 920
250
Melting Onset (Solidus), °C 710
180
Specific Heat Capacity, J/kg-K 400
160
Thermal Conductivity, W/m-K 200
43
Thermal Expansion, µm/m-K 17
27

Otherwise Unclassified Properties

Base Metal Price, % relative 29
95
Density, g/cm3 8.6
9.9
Embodied Carbon, kg CO2/kg material 2.5
7.8
Embodied Energy, MJ/kg 39
130
Embodied Water, L/kg 290
730

Common Calculations

Stiffness to Weight: Axial, points 7.1
1.6
Stiffness to Weight: Bending, points 18
10
Strength to Weight: Axial, points 6.4
1.0
Strength to Weight: Bending, points 8.8
2.4
Thermal Diffusivity, mm2/s 56
27
Thermal Shock Resistance, points 7.9
3.4

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.25
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 94.7 to 95.2
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
63.4 to 65.5
Nickel (Ni), % 0
0 to 0.010
Phosphorus (P), % 4.8 to 5.2
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
34.5 to 35.5
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.15
0