C55280 Copper vs. CC383H Copper-nickel
Both C55280 copper and CC383H copper-nickel are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 67% of their average alloy composition in common. There are 18 material properties with values for both materials. Properties with values for just one material (12, in this case) are not shown.
For each property being compared, the top bar is C55280 copper and the bottom bar is CC383H copper-nickel.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 110 | |
| 140 |
| Poisson's Ratio | 0.34 | |
| 0.33 |
| Shear Modulus, GPa | 40 | |
| 52 |
| Tensile Strength: Ultimate (UTS), MPa | 180 | |
| 490 |
Thermal Properties
| Latent Heat of Fusion, J/g | 190 | |
| 240 |
| Maximum Temperature: Mechanical, °C | 200 | |
| 260 |
| Melting Completion (Liquidus), °C | 790 | |
| 1180 |
| Melting Onset (Solidus), °C | 640 | |
| 1130 |
| Specific Heat Capacity, J/kg-K | 410 | |
| 410 |
| Thermal Expansion, µm/m-K | 16 | |
| 15 |
Otherwise Unclassified Properties
| Density, g/cm3 | 8.5 | |
| 8.9 |
| Embodied Carbon, kg CO2/kg material | 4.2 | |
| 5.7 |
| Embodied Energy, MJ/kg | 67 | |
| 83 |
Common Calculations
| Stiffness to Weight: Axial, points | 6.9 | |
| 8.6 |
| Stiffness to Weight: Bending, points | 19 | |
| 19 |
| Strength to Weight: Axial, points | 5.9 | |
| 15 |
| Strength to Weight: Bending, points | 8.3 | |
| 16 |
| Thermal Shock Resistance, points | 7.4 | |
| 17 |
Alloy Composition
| Aluminum (Al), % | 0 | |
| 0 to 0.010 |
| Bismuth (Bi), % | 0 | |
| 0 to 0.010 |
| Boron (B), % | 0 | |
| 0 to 0.010 |
| Cadmium (Cd), % | 0 | |
| 0 to 0.020 |
| Carbon (C), % | 0 | |
| 0 to 0.030 |
| Copper (Cu), % | 90.5 to 91.4 | |
| 64 to 69.1 |
| Iron (Fe), % | 0 | |
| 0.5 to 1.5 |
| Lead (Pb), % | 0 | |
| 0 to 0.010 |
| Magnesium (Mg), % | 0 | |
| 0 to 0.010 |
| Manganese (Mn), % | 0 | |
| 0.6 to 1.2 |
| Nickel (Ni), % | 0 | |
| 29 to 31 |
| Niobium (Nb), % | 0 | |
| 0.5 to 1.0 |
| Phosphorus (P), % | 6.8 to 7.2 | |
| 0 to 0.010 |
| Selenium (Se), % | 0 | |
| 0 to 0.010 |
| Silicon (Si), % | 0 | |
| 0.3 to 0.7 |
| Silver (Ag), % | 1.8 to 2.2 | |
| 0 |
| Sulfur (S), % | 0 | |
| 0 to 0.010 |
| Tellurium (Te), % | 0 | |
| 0 to 0.010 |
| Zinc (Zn), % | 0 | |
| 0 to 0.5 |
| Residuals, % | 0 to 0.15 | |
| 0 |