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C55280 Copper vs. Solder Alloy 115

C55280 copper belongs to the copper alloys classification, while solder alloy 115 belongs to the otherwise unclassified metals. There are 17 material properties with values for both materials. Properties with values for just one material (10, in this case) are not shown.

For each property being compared, the top bar is C55280 copper and the bottom bar is solder alloy 115.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
28
Poisson's Ratio 0.34
0.41
Shear Modulus, GPa 40
10
Tensile Strength: Ultimate (UTS), MPa 180
36

Thermal Properties

Latent Heat of Fusion, J/g 190
36
Melting Completion (Liquidus), °C 790
250
Melting Onset (Solidus), °C 640
180
Specific Heat Capacity, J/kg-K 410
160
Thermal Expansion, µm/m-K 16
27

Otherwise Unclassified Properties

Density, g/cm3 8.5
9.9
Embodied Carbon, kg CO2/kg material 4.2
7.8
Embodied Energy, MJ/kg 67
130

Common Calculations

Stiffness to Weight: Axial, points 6.9
1.6
Stiffness to Weight: Bending, points 19
10
Strength to Weight: Axial, points 5.9
1.0
Strength to Weight: Bending, points 8.3
2.4
Thermal Shock Resistance, points 7.4
3.4

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.25
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 90.5 to 91.4
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
63.4 to 65.5
Nickel (Ni), % 0
0 to 0.010
Phosphorus (P), % 6.8 to 7.2
0
Silver (Ag), % 1.8 to 2.2
0 to 0.1
Tin (Sn), % 0
34.5 to 35.5
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.15
0