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C55280 Copper vs. Solder Alloy 601

C55280 copper belongs to the copper alloys classification, while solder alloy 601 belongs to the otherwise unclassified metals. There are 15 material properties with values for both materials. Properties with values for just one material (11, in this case) are not shown.

For each property being compared, the top bar is C55280 copper and the bottom bar is solder alloy 601.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
31
Poisson's Ratio 0.34
0.41
Shear Modulus, GPa 40
11
Tensile Strength: Ultimate (UTS), MPa 180
12

Thermal Properties

Latent Heat of Fusion, J/g 190
43
Melting Completion (Liquidus), °C 790
120
Melting Onset (Solidus), °C 640
120
Specific Heat Capacity, J/kg-K 410
230
Thermal Expansion, µm/m-K 16
23

Otherwise Unclassified Properties

Density, g/cm3 8.5
7.3

Common Calculations

Stiffness to Weight: Axial, points 6.9
2.3
Stiffness to Weight: Bending, points 19
14
Strength to Weight: Axial, points 5.9
0.45
Strength to Weight: Bending, points 8.3
1.6
Thermal Shock Resistance, points 7.4
1.2

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 90.5 to 91.4
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
51 to 52.5
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Phosphorus (P), % 6.8 to 7.2
0
Silver (Ag), % 1.8 to 2.2
0 to 0.1
Tin (Sn), % 0
47.5 to 48.5
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.15
0