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C55282 Copper vs. Solder Alloy 801

C55282 copper belongs to the copper alloys classification, while solder alloy 801 belongs to the otherwise unclassified metals. There are 17 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is C55282 copper and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
53
Poisson's Ratio 0.34
0.35
Shear Modulus, GPa 39
20
Tensile Strength: Ultimate (UTS), MPa 180
55

Thermal Properties

Latent Heat of Fusion, J/g 190
64
Melting Completion (Liquidus), °C 770
200
Melting Onset (Solidus), °C 640
200
Specific Heat Capacity, J/kg-K 400
240
Thermal Expansion, µm/m-K 16
22

Otherwise Unclassified Properties

Density, g/cm3 8.6
7.2
Embodied Carbon, kg CO2/kg material 7.0
14
Embodied Energy, MJ/kg 110
240

Common Calculations

Stiffness to Weight: Axial, points 6.8
4.1
Stiffness to Weight: Bending, points 18
17
Strength to Weight: Axial, points 5.8
2.1
Strength to Weight: Bending, points 8.2
4.4
Thermal Shock Resistance, points 7.4
3.3

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 87.7 to 88.7
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Phosphorus (P), % 6.5 to 7.0
0
Silver (Ag), % 4.8 to 5.2
0 to 0.1
Tin (Sn), % 0
89.9 to 91.5
Zinc (Zn), % 0
8.5 to 9.5
Residuals, % 0 to 0.15
0