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C55283 Copper vs. Solder Alloy 111

C55283 copper belongs to the copper alloys classification, while solder alloy 111 belongs to the otherwise unclassified metals. There are 17 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is C55283 copper and the bottom bar is solder alloy 111.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
33
Poisson's Ratio 0.34
0.4
Shear Modulus, GPa 39
12
Tensile Strength: Ultimate (UTS), MPa 190
41

Thermal Properties

Latent Heat of Fusion, J/g 190
41
Melting Completion (Liquidus), °C 720
220
Melting Onset (Solidus), °C 640
180
Specific Heat Capacity, J/kg-K 400
180
Thermal Expansion, µm/m-K 16
26

Otherwise Unclassified Properties

Density, g/cm3 8.6
9.3
Embodied Carbon, kg CO2/kg material 7.9
9.4
Embodied Energy, MJ/kg 120
160

Common Calculations

Stiffness to Weight: Axial, points 6.8
2.0
Stiffness to Weight: Bending, points 18
12
Strength to Weight: Axial, points 6.1
1.2
Strength to Weight: Bending, points 8.5
2.8
Thermal Shock Resistance, points 8.0
3.5

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 86.2 to 87.2
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
48.8 to 50.5
Nickel (Ni), % 0
0 to 0.010
Phosphorus (P), % 7.0 to 7.5
0
Silver (Ag), % 5.8 to 6.2
0 to 0.1
Tin (Sn), % 0
49.5 to 50.5
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.15
0