C55283 Copper vs. Solder Alloy 171
C55283 copper belongs to the copper alloys classification, while solder alloy 171 belongs to the otherwise unclassified metals. There are 17 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.
For each property being compared, the top bar is C55283 copper and the bottom bar is solder alloy 171.
Metric UnitsUS Customary Units
Mechanical Properties
Elastic (Young's, Tensile) Modulus, GPa | 100 | |
38 |
Poisson's Ratio | 0.34 | |
0.39 |
Shear Modulus, GPa | 39 | |
14 |
Tensile Strength: Ultimate (UTS), MPa | 190 | |
48 |
Thermal Properties
Latent Heat of Fusion, J/g | 190 | |
47 |
Melting Completion (Liquidus), °C | 720 | |
180 |
Melting Onset (Solidus), °C | 640 | |
180 |
Specific Heat Capacity, J/kg-K | 400 | |
190 |
Thermal Expansion, µm/m-K | 16 | |
24 |
Otherwise Unclassified Properties
Density, g/cm3 | 8.6 | |
8.8 |
Embodied Carbon, kg CO2/kg material | 7.9 | |
13 |
Embodied Energy, MJ/kg | 120 | |
210 |
Common Calculations
Stiffness to Weight: Axial, points | 6.8 | |
2.4 |
Stiffness to Weight: Bending, points | 18 | |
13 |
Strength to Weight: Axial, points | 6.1 | |
1.5 |
Strength to Weight: Bending, points | 8.5 | |
3.3 |
Thermal Shock Resistance, points | 8.0 | |
3.7 |
Alloy Composition
Aluminum (Al), % | 0 | |
0 to 0.0010 |
Antimony (Sb), % | 0 | |
0 to 0.2 |
Arsenic (As), % | 0 | |
0 to 0.030 |
Bismuth (Bi), % | 0 | |
0 to 0.1 |
Cadmium (Cd), % | 0 | |
0 to 0.0020 |
Copper (Cu), % | 86.2 to 87.2 | |
0 to 0.080 |
Gold (Au), % | 0 | |
0 to 0.050 |
Indium (In), % | 0 | |
0 to 0.1 |
Iron (Fe), % | 0 | |
0 to 0.020 |
Lead (Pb), % | 0 | |
34.7 to 36.7 |
Nickel (Ni), % | 0 | |
0 to 0.010 |
Phosphorus (P), % | 7.0 to 7.5 | |
0 |
Silver (Ag), % | 5.8 to 6.2 | |
1.8 to 2.2 |
Tin (Sn), % | 0 | |
61.5 to 62.5 |
Zinc (Zn), % | 0 | |
0 to 0.0010 |
Residuals, % | 0 to 0.15 | |
0 |