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C55283 Copper vs. Solder Alloy 182

C55283 copper belongs to the copper alloys classification, while solder alloy 182 belongs to the otherwise unclassified metals. There are 17 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C55283 copper and the bottom bar is solder alloy 182.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
19
Poisson's Ratio 0.34
0.44
Shear Modulus, GPa 39
6.7
Tensile Strength: Ultimate (UTS), MPa 190
28

Thermal Properties

Latent Heat of Fusion, J/g 190
28
Melting Completion (Liquidus), °C 720
370
Melting Onset (Solidus), °C 640
300
Specific Heat Capacity, J/kg-K 400
130
Thermal Expansion, µm/m-K 16
29

Otherwise Unclassified Properties

Density, g/cm3 8.6
11
Embodied Carbon, kg CO2/kg material 7.9
9.0
Embodied Energy, MJ/kg 120
140

Common Calculations

Stiffness to Weight: Axial, points 6.8
0.95
Stiffness to Weight: Bending, points 18
7.9
Strength to Weight: Axial, points 6.1
0.69
Strength to Weight: Bending, points 8.5
1.8
Thermal Shock Resistance, points 8.0
3.7

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 86.2 to 87.2
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
93.2 to 95
Nickel (Ni), % 0
0 to 0.010
Phosphorus (P), % 7.0 to 7.5
0
Silver (Ag), % 5.8 to 6.2
5.0 to 6.0
Tin (Sn), % 0
0 to 0.25
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.15
0