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C55283 Copper vs. Solder Alloy 503

C55283 copper belongs to the copper alloys classification, while solder alloy 503 belongs to the otherwise unclassified metals. There are 17 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C55283 copper and the bottom bar is solder alloy 503.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
54
Poisson's Ratio 0.34
0.36
Shear Modulus, GPa 39
20
Tensile Strength: Ultimate (UTS), MPa 190
57

Thermal Properties

Latent Heat of Fusion, J/g 190
69
Melting Completion (Liquidus), °C 720
380
Melting Onset (Solidus), °C 640
220
Specific Heat Capacity, J/kg-K 400
230
Thermal Expansion, µm/m-K 16
22

Otherwise Unclassified Properties

Density, g/cm3 8.6
7.5
Embodied Carbon, kg CO2/kg material 7.9
16
Embodied Energy, MJ/kg 120
270

Common Calculations

Stiffness to Weight: Axial, points 6.8
4.1
Stiffness to Weight: Bending, points 18
17
Strength to Weight: Axial, points 6.1
2.1
Strength to Weight: Bending, points 8.5
4.4
Thermal Shock Resistance, points 8.0
3.5

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.080
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 86.2 to 87.2
5.5 to 6.5
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0
0 to 0.070
Nickel (Ni), % 0
0 to 0.010
Phosphorus (P), % 7.0 to 7.5
0
Silver (Ag), % 5.8 to 6.2
1.8 to 2.2
Tin (Sn), % 0
90.8 to 92.7
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.15
0