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C66200 Brass vs. CC382H Copper-nickel

Both C66200 brass and CC382H copper-nickel are copper alloys. They have 66% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C66200 brass and the bottom bar is CC382H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
140
Elongation at Break, % 8.0 to 15
20
Poisson's Ratio 0.33
0.33
Shear Modulus, GPa 42
53
Tensile Strength: Ultimate (UTS), MPa 450 to 520
490
Tensile Strength: Yield (Proof), MPa 410 to 480
290

Thermal Properties

Latent Heat of Fusion, J/g 200
240
Maximum Temperature: Mechanical, °C 180
260
Melting Completion (Liquidus), °C 1070
1180
Melting Onset (Solidus), °C 1030
1120
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 150
30
Thermal Expansion, µm/m-K 18
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 35
5.5
Electrical Conductivity: Equal Weight (Specific), % IACS 36
5.6

Otherwise Unclassified Properties

Base Metal Price, % relative 29
41
Density, g/cm3 8.7
8.9
Embodied Carbon, kg CO2/kg material 2.7
5.2
Embodied Energy, MJ/kg 43
76
Embodied Water, L/kg 320
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 40 to 66
85
Resilience: Unit (Modulus of Resilience), kJ/m3 760 to 1030
290
Stiffness to Weight: Axial, points 7.2
8.8
Stiffness to Weight: Bending, points 19
20
Strength to Weight: Axial, points 14 to 17
15
Strength to Weight: Bending, points 15 to 16
16
Thermal Diffusivity, mm2/s 45
8.2
Thermal Shock Resistance, points 16 to 18
16

Alloy Composition

Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0
0 to 0.0020
Boron (B), % 0
0 to 0.010
Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0
1.5 to 2.0
Copper (Cu), % 86.6 to 91
62.8 to 68.4
Iron (Fe), % 0 to 0.050
0.5 to 1.0
Lead (Pb), % 0 to 0.050
0 to 0.0050
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.5 to 1.0
Nickel (Ni), % 0.3 to 1.0
29 to 32
Phosphorus (P), % 0.050 to 0.2
0 to 0.010
Selenium (Se), % 0
0 to 0.0050
Silicon (Si), % 0
0.15 to 0.5
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.0050
Tin (Sn), % 0.2 to 0.7
0
Titanium (Ti), % 0
0 to 0.25
Zinc (Zn), % 6.5 to 12.9
0 to 0.2
Zirconium (Zr), % 0
0 to 0.15
Residuals, % 0 to 0.5
0