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C66200 Brass vs. Grade M30H Nickel

C66200 brass belongs to the copper alloys classification, while grade M30H nickel belongs to the nickel alloys. They have a modest 31% of their average alloy composition in common, which, by itself, doesn't mean much. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C66200 brass and the bottom bar is grade M30H nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
160
Elongation at Break, % 8.0 to 15
11
Poisson's Ratio 0.33
0.32
Shear Modulus, GPa 42
61
Tensile Strength: Ultimate (UTS), MPa 450 to 520
770
Tensile Strength: Yield (Proof), MPa 410 to 480
470

Thermal Properties

Latent Heat of Fusion, J/g 200
320
Maximum Temperature: Mechanical, °C 180
900
Melting Completion (Liquidus), °C 1070
1250
Melting Onset (Solidus), °C 1030
1200
Specific Heat Capacity, J/kg-K 390
440
Thermal Conductivity, W/m-K 150
22
Thermal Expansion, µm/m-K 18
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 35
3.3
Electrical Conductivity: Equal Weight (Specific), % IACS 36
3.4

Otherwise Unclassified Properties

Base Metal Price, % relative 29
50
Density, g/cm3 8.7
8.6
Embodied Carbon, kg CO2/kg material 2.7
7.7
Embodied Energy, MJ/kg 43
110
Embodied Water, L/kg 320
250

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 40 to 66
75
Resilience: Unit (Modulus of Resilience), kJ/m3 760 to 1030
700
Stiffness to Weight: Axial, points 7.2
10
Stiffness to Weight: Bending, points 19
21
Strength to Weight: Axial, points 14 to 17
25
Strength to Weight: Bending, points 15 to 16
22
Thermal Diffusivity, mm2/s 45
5.7
Thermal Shock Resistance, points 16 to 18
27

Alloy Composition

Carbon (C), % 0
0 to 0.3
Copper (Cu), % 86.6 to 91
27 to 33
Iron (Fe), % 0 to 0.050
0 to 3.5
Lead (Pb), % 0 to 0.050
0
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0.3 to 1.0
57.9 to 70.3
Phosphorus (P), % 0.050 to 0.2
0 to 0.030
Silicon (Si), % 0
2.7 to 3.7
Sulfur (S), % 0
0 to 0.030
Tin (Sn), % 0.2 to 0.7
0
Zinc (Zn), % 6.5 to 12.9
0
Residuals, % 0 to 0.5
0