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C66200 Brass vs. Solder Alloy 501

C66200 brass belongs to the copper alloys classification, while solder alloy 501 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C66200 brass and the bottom bar is solder alloy 501.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
51
Elongation at Break, % 8.0 to 15
22
Poisson's Ratio 0.33
0.36
Shear Modulus, GPa 42
19
Tensile Strength: Ultimate (UTS), MPa 450 to 520
29

Thermal Properties

Latent Heat of Fusion, J/g 200
60
Melting Completion (Liquidus), °C 1070
230
Melting Onset (Solidus), °C 1030
220
Specific Heat Capacity, J/kg-K 390
220
Thermal Conductivity, W/m-K 150
67
Thermal Expansion, µm/m-K 18
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 35
14
Electrical Conductivity: Equal Weight (Specific), % IACS 36
17

Otherwise Unclassified Properties

Density, g/cm3 8.7
7.3
Embodied Carbon, kg CO2/kg material 2.7
15
Embodied Energy, MJ/kg 43
260
Embodied Water, L/kg 320
1390

Common Calculations

Stiffness to Weight: Axial, points 7.2
3.8
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 14 to 17
1.1
Strength to Weight: Bending, points 15 to 16
2.9
Thermal Diffusivity, mm2/s 45
41
Thermal Shock Resistance, points 16 to 18
1.9

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.060
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 86.6 to 91
0.5 to 0.9
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.050
0 to 0.020
Lead (Pb), % 0 to 0.050
0 to 0.070
Nickel (Ni), % 0.3 to 1.0
0 to 0.010
Phosphorus (P), % 0.050 to 0.2
0
Silver (Ag), % 0
0.2 to 0.4
Tin (Sn), % 0.2 to 0.7
98.3 to 99.3
Zinc (Zn), % 6.5 to 12.9
0 to 0.0010
Residuals, % 0 to 0.5
0