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C66900 Brass vs. CC383H Copper-nickel

Both C66900 brass and CC383H copper-nickel are copper alloys. They have 65% of their average alloy composition in common. There are 26 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C66900 brass and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
140
Elongation at Break, % 1.1 to 26
20
Poisson's Ratio 0.32
0.33
Shear Modulus, GPa 45
52
Tensile Strength: Ultimate (UTS), MPa 460 to 770
490
Tensile Strength: Yield (Proof), MPa 330 to 760
260

Thermal Properties

Latent Heat of Fusion, J/g 190
240
Maximum Temperature: Mechanical, °C 150
260
Melting Completion (Liquidus), °C 860
1180
Melting Onset (Solidus), °C 850
1130
Specific Heat Capacity, J/kg-K 400
410
Thermal Expansion, µm/m-K 20
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.4
5.2
Electrical Conductivity: Equal Weight (Specific), % IACS 3.8
5.3

Otherwise Unclassified Properties

Base Metal Price, % relative 23
44
Density, g/cm3 8.2
8.9
Embodied Carbon, kg CO2/kg material 2.8
5.7
Embodied Energy, MJ/kg 46
83
Embodied Water, L/kg 310
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 4.6 to 200
84
Resilience: Unit (Modulus of Resilience), kJ/m3 460 to 2450
250
Stiffness to Weight: Axial, points 8.1
8.6
Stiffness to Weight: Bending, points 20
19
Strength to Weight: Axial, points 15 to 26
15
Strength to Weight: Bending, points 16 to 23
16
Thermal Shock Resistance, points 14 to 23
17

Alloy Composition

Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0
0 to 0.020
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 62.5 to 64.5
64 to 69.1
Iron (Fe), % 0 to 0.25
0.5 to 1.5
Lead (Pb), % 0 to 0.050
0 to 0.010
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 11.5 to 12.5
0.6 to 1.2
Nickel (Ni), % 0
29 to 31
Niobium (Nb), % 0
0.5 to 1.0
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0
0.3 to 0.7
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Zinc (Zn), % 22.5 to 26
0 to 0.5
Residuals, % 0 to 0.2
0