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C68000 Brass vs. CC383H Copper-nickel

Both C68000 brass and CC383H copper-nickel are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 60% of their average alloy composition in common. There are 26 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C68000 brass and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
140
Elongation at Break, % 27
20
Poisson's Ratio 0.3
0.33
Shear Modulus, GPa 40
52
Tensile Strength: Ultimate (UTS), MPa 390
490
Tensile Strength: Yield (Proof), MPa 140
260

Thermal Properties

Latent Heat of Fusion, J/g 170
240
Maximum Temperature: Mechanical, °C 120
260
Melting Completion (Liquidus), °C 880
1180
Melting Onset (Solidus), °C 870
1130
Specific Heat Capacity, J/kg-K 390
410
Thermal Conductivity, W/m-K 96
29
Thermal Expansion, µm/m-K 21
15

Otherwise Unclassified Properties

Base Metal Price, % relative 23
44
Density, g/cm3 8.0
8.9
Embodied Carbon, kg CO2/kg material 2.8
5.7
Embodied Energy, MJ/kg 48
83
Embodied Water, L/kg 330
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 82
84
Resilience: Unit (Modulus of Resilience), kJ/m3 95
250
Stiffness to Weight: Axial, points 7.3
8.6
Stiffness to Weight: Bending, points 20
19
Strength to Weight: Axial, points 14
15
Strength to Weight: Bending, points 15
16
Thermal Diffusivity, mm2/s 31
8.1
Thermal Shock Resistance, points 13
17

Alloy Composition

Aluminum (Al), % 0 to 0.010
0 to 0.010
Bismuth (Bi), % 0
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0
0 to 0.020
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 56 to 60
64 to 69.1
Iron (Fe), % 0.25 to 1.3
0.5 to 1.5
Lead (Pb), % 0 to 0.050
0 to 0.010
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0.010 to 0.5
0.6 to 1.2
Nickel (Ni), % 0.2 to 0.8
29 to 31
Niobium (Nb), % 0
0.5 to 1.0
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0.040 to 0.15
0.3 to 0.7
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Tin (Sn), % 0.75 to 1.1
0
Zinc (Zn), % 35.6 to 42.8
0 to 0.5
Residuals, % 0 to 0.5
0