C68300 Brass vs. Solder Alloy 137
C68300 brass belongs to the copper alloys classification, while solder alloy 137 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.
For each property being compared, the top bar is C68300 brass and the bottom bar is solder alloy 137.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 100 | |
| 24 |
| Elongation at Break, % | 15 | |
| 19 |
| Poisson's Ratio | 0.31 | |
| 0.42 |
| Shear Modulus, GPa | 40 | |
| 8.3 |
| Tensile Strength: Ultimate (UTS), MPa | 430 | |
| 34 |
Thermal Properties
| Latent Heat of Fusion, J/g | 180 | |
| 33 |
| Melting Completion (Liquidus), °C | 900 | |
| 270 |
| Melting Onset (Solidus), °C | 890 | |
| 190 |
| Specific Heat Capacity, J/kg-K | 390 | |
| 150 |
| Thermal Conductivity, W/m-K | 120 | |
| 38 |
| Thermal Expansion, µm/m-K | 20 | |
| 27 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 23 | |
| 85 |
| Density, g/cm3 | 8.0 | |
| 10 |
| Embodied Carbon, kg CO2/kg material | 2.8 | |
| 6.3 |
| Embodied Energy, MJ/kg | 46 | |
| 100 |
| Embodied Water, L/kg | 340 | |
| 660 |
Common Calculations
| Stiffness to Weight: Axial, points | 7.3 | |
| 1.3 |
| Stiffness to Weight: Bending, points | 20 | |
| 9.2 |
| Strength to Weight: Axial, points | 15 | |
| 0.9 |
| Strength to Weight: Bending, points | 16 | |
| 2.2 |
| Thermal Diffusivity, mm2/s | 38 | |
| 25 |
| Thermal Shock Resistance, points | 14 | |
| 3.7 |
Alloy Composition
| Aluminum (Al), % | 0 | |
| 0 to 0.0010 |
| Antimony (Sb), % | 0.3 to 1.0 | |
| 0.5 to 3.0 |
| Arsenic (As), % | 0 | |
| 0 to 0.030 |
| Bismuth (Bi), % | 0 | |
| 0 to 0.25 |
| Cadmium (Cd), % | 0 to 0.010 | |
| 0 to 0.0050 |
| Copper (Cu), % | 59 to 63 | |
| 0 to 0.080 |
| Gold (Au), % | 0 | |
| 0 to 0.050 |
| Indium (In), % | 0 | |
| 0 to 0.1 |
| Iron (Fe), % | 0 | |
| 0 to 0.020 |
| Lead (Pb), % | 0 to 0.090 | |
| 75.9 to 80 |
| Nickel (Ni), % | 0 | |
| 0 to 0.010 |
| Silicon (Si), % | 0.3 to 1.0 | |
| 0 |
| Silver (Ag), % | 0 | |
| 0 to 0.1 |
| Tin (Sn), % | 0.050 to 0.2 | |
| 19.5 to 20.5 |
| Zinc (Zn), % | 34.2 to 40.4 | |
| 0 to 0.0010 |
| Residuals, % | 0 to 0.5 | |
| 0 |