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C68400 Brass vs. Solder Alloy 811

C68400 brass belongs to the copper alloys classification, while solder alloy 811 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C68400 brass and the bottom bar is solder alloy 811.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
52
Elongation at Break, % 18
38
Poisson's Ratio 0.31
0.35
Shear Modulus, GPa 41
19
Tensile Strength: Ultimate (UTS), MPa 540
53

Thermal Properties

Latent Heat of Fusion, J/g 210
63
Melting Completion (Liquidus), °C 840
200
Melting Onset (Solidus), °C 820
190
Specific Heat Capacity, J/kg-K 400
230
Thermal Conductivity, W/m-K 66
59
Thermal Expansion, µm/m-K 20
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 87
14
Electrical Conductivity: Equal Weight (Specific), % IACS 99
17

Otherwise Unclassified Properties

Density, g/cm3 7.9
7.3
Embodied Carbon, kg CO2/kg material 2.7
14
Embodied Energy, MJ/kg 47
240
Embodied Water, L/kg 320
1200

Common Calculations

Stiffness to Weight: Axial, points 7.5
4.0
Stiffness to Weight: Bending, points 20
17
Strength to Weight: Axial, points 19
2.0
Strength to Weight: Bending, points 19
4.3
Thermal Diffusivity, mm2/s 21
35
Thermal Shock Resistance, points 18
3.3

Alloy Composition

Aluminum (Al), % 0 to 0.5
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
2.8 to 3.2
Boron (B), % 0.0010 to 0.030
0
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 59 to 64
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 1.0
0 to 0.020
Lead (Pb), % 0 to 0.090
0 to 0.070
Manganese (Mn), % 0.2 to 1.5
0
Nickel (Ni), % 0 to 0.5
0 to 0.010
Phosphorus (P), % 0.030 to 0.3
0
Silicon (Si), % 1.5 to 2.5
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0 to 0.5
87.8 to 89.7
Zinc (Zn), % 28.6 to 39.3
7.5 to 8.5
Residuals, % 0 to 0.5
0