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C68400 Brass vs. C71520 Copper-nickel

Both C68400 brass and C71520 copper-nickel are copper alloys. They have 63% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C68400 brass and the bottom bar is C71520 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
140
Elongation at Break, % 18
10 to 45
Poisson's Ratio 0.31
0.33
Shear Modulus, GPa 41
51
Shear Strength, MPa 330
250 to 340
Tensile Strength: Ultimate (UTS), MPa 540
370 to 570
Tensile Strength: Yield (Proof), MPa 310
140 to 430

Thermal Properties

Latent Heat of Fusion, J/g 210
230
Maximum Temperature: Mechanical, °C 130
260
Melting Completion (Liquidus), °C 840
1170
Melting Onset (Solidus), °C 820
1120
Specific Heat Capacity, J/kg-K 400
400
Thermal Conductivity, W/m-K 66
32
Thermal Expansion, µm/m-K 20
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 87
5.7
Electrical Conductivity: Equal Weight (Specific), % IACS 99
5.8

Otherwise Unclassified Properties

Base Metal Price, % relative 23
40
Density, g/cm3 7.9
8.9
Embodied Carbon, kg CO2/kg material 2.7
5.0
Embodied Energy, MJ/kg 47
73
Embodied Water, L/kg 320
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 81
54 to 130
Resilience: Unit (Modulus of Resilience), kJ/m3 460
67 to 680
Stiffness to Weight: Axial, points 7.5
8.6
Stiffness to Weight: Bending, points 20
19
Strength to Weight: Axial, points 19
12 to 18
Strength to Weight: Bending, points 19
13 to 17
Thermal Diffusivity, mm2/s 21
8.9
Thermal Shock Resistance, points 18
12 to 19

Alloy Composition

Aluminum (Al), % 0 to 0.5
0
Boron (B), % 0.0010 to 0.030
0
Carbon (C), % 0
0 to 0.050
Copper (Cu), % 59 to 64
65 to 71.6
Iron (Fe), % 0 to 1.0
0.4 to 1.0
Lead (Pb), % 0 to 0.090
0 to 0.020
Manganese (Mn), % 0.2 to 1.5
0 to 1.0
Nickel (Ni), % 0 to 0.5
28 to 33
Phosphorus (P), % 0.030 to 0.3
0 to 0.2
Silicon (Si), % 1.5 to 2.5
0
Sulfur (S), % 0
0 to 0.020
Tin (Sn), % 0 to 0.5
0
Zinc (Zn), % 28.6 to 39.3
0 to 0.5
Residuals, % 0
0 to 0.5