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C68800 Brass vs. CC382H Copper-nickel

Both C68800 brass and CC382H copper-nickel are copper alloys. They have 66% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C68800 brass and the bottom bar is CC382H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
140
Elongation at Break, % 2.0 to 36
20
Poisson's Ratio 0.32
0.33
Shear Modulus, GPa 41
53
Tensile Strength: Ultimate (UTS), MPa 570 to 890
490
Tensile Strength: Yield (Proof), MPa 390 to 790
290

Thermal Properties

Latent Heat of Fusion, J/g 190
240
Maximum Temperature: Mechanical, °C 160
260
Melting Completion (Liquidus), °C 960
1180
Melting Onset (Solidus), °C 950
1120
Specific Heat Capacity, J/kg-K 400
410
Thermal Conductivity, W/m-K 40
30
Thermal Expansion, µm/m-K 19
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 18
5.5
Electrical Conductivity: Equal Weight (Specific), % IACS 20
5.6

Otherwise Unclassified Properties

Base Metal Price, % relative 26
41
Density, g/cm3 8.2
8.9
Embodied Carbon, kg CO2/kg material 2.8
5.2
Embodied Energy, MJ/kg 48
76
Embodied Water, L/kg 350
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 16 to 180
85
Resilience: Unit (Modulus of Resilience), kJ/m3 710 to 2860
290
Stiffness to Weight: Axial, points 7.3
8.8
Stiffness to Weight: Bending, points 19
20
Strength to Weight: Axial, points 19 to 30
15
Strength to Weight: Bending, points 19 to 25
16
Thermal Diffusivity, mm2/s 12
8.2
Thermal Shock Resistance, points 19 to 30
16

Alloy Composition

Aluminum (Al), % 3.0 to 3.8
0 to 0.010
Bismuth (Bi), % 0
0 to 0.0020
Boron (B), % 0
0 to 0.010
Carbon (C), % 0
0 to 0.030
Chromium (Cr), % 0
1.5 to 2.0
Cobalt (Co), % 0.25 to 0.55
0
Copper (Cu), % 70.8 to 75.5
62.8 to 68.4
Iron (Fe), % 0 to 0.2
0.5 to 1.0
Lead (Pb), % 0 to 0.050
0 to 0.0050
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.5 to 1.0
Nickel (Ni), % 0
29 to 32
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.0050
Silicon (Si), % 0
0.15 to 0.5
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.0050
Titanium (Ti), % 0
0 to 0.25
Zinc (Zn), % 21.3 to 24.1
0 to 0.2
Zirconium (Zr), % 0
0 to 0.15
Residuals, % 0 to 0.5
0