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C68800 Brass vs. CC383H Copper-nickel

Both C68800 brass and CC383H copper-nickel are copper alloys. They have 67% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C68800 brass and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
140
Elongation at Break, % 2.0 to 36
20
Poisson's Ratio 0.32
0.33
Shear Modulus, GPa 41
52
Tensile Strength: Ultimate (UTS), MPa 570 to 890
490
Tensile Strength: Yield (Proof), MPa 390 to 790
260

Thermal Properties

Latent Heat of Fusion, J/g 190
240
Maximum Temperature: Mechanical, °C 160
260
Melting Completion (Liquidus), °C 960
1180
Melting Onset (Solidus), °C 950
1130
Specific Heat Capacity, J/kg-K 400
410
Thermal Conductivity, W/m-K 40
29
Thermal Expansion, µm/m-K 19
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 18
5.2
Electrical Conductivity: Equal Weight (Specific), % IACS 20
5.3

Otherwise Unclassified Properties

Base Metal Price, % relative 26
44
Density, g/cm3 8.2
8.9
Embodied Carbon, kg CO2/kg material 2.8
5.7
Embodied Energy, MJ/kg 48
83
Embodied Water, L/kg 350
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 16 to 180
84
Resilience: Unit (Modulus of Resilience), kJ/m3 710 to 2860
250
Stiffness to Weight: Axial, points 7.3
8.6
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 19 to 30
15
Strength to Weight: Bending, points 19 to 25
16
Thermal Diffusivity, mm2/s 12
8.1
Thermal Shock Resistance, points 19 to 30
17

Alloy Composition

Aluminum (Al), % 3.0 to 3.8
0 to 0.010
Bismuth (Bi), % 0
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0
0 to 0.020
Carbon (C), % 0
0 to 0.030
Cobalt (Co), % 0.25 to 0.55
0
Copper (Cu), % 70.8 to 75.5
64 to 69.1
Iron (Fe), % 0 to 0.2
0.5 to 1.5
Lead (Pb), % 0 to 0.050
0 to 0.010
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 0
29 to 31
Niobium (Nb), % 0
0.5 to 1.0
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0
0.3 to 0.7
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Zinc (Zn), % 21.3 to 24.1
0 to 0.5
Residuals, % 0 to 0.5
0