MakeItFrom.com
Menu (ESC)

C70250 Copper vs. Solder Alloy 501

C70250 copper belongs to the copper alloys classification, while solder alloy 501 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C70250 copper and the bottom bar is solder alloy 501.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
51
Poisson's Ratio 0.34
0.36
Shear Modulus, GPa 44
19
Tensile Strength: Ultimate (UTS), MPa 520 to 740
29

Thermal Properties

Latent Heat of Fusion, J/g 220
60
Melting Completion (Liquidus), °C 1100
230
Melting Onset (Solidus), °C 1080
220
Specific Heat Capacity, J/kg-K 390
220
Thermal Conductivity, W/m-K 170
67
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 36 to 50
14
Electrical Conductivity: Equal Weight (Specific), % IACS 37 to 51
17

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.3
Embodied Carbon, kg CO2/kg material 2.9
15
Embodied Energy, MJ/kg 45
260
Embodied Water, L/kg 310
1390

Common Calculations

Stiffness to Weight: Axial, points 7.4
3.8
Stiffness to Weight: Bending, points 18
17
Strength to Weight: Axial, points 16 to 23
1.1
Strength to Weight: Bending, points 16 to 21
2.9
Thermal Diffusivity, mm2/s 49
41
Thermal Shock Resistance, points 18 to 26
1.9

Alloy Composition

Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.060
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 92.7 to 97.5
0.5 to 0.9
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0
0 to 0.020
Lead (Pb), % 0 to 0.050
0 to 0.070
Magnesium (Mg), % 0.050 to 0.3
0
Manganese (Mn), % 0 to 0.1
0
Nickel (Ni), % 2.2 to 4.2
0 to 0.010
Silicon (Si), % 0.25 to 1.2
0
Silver (Ag), % 0
0.2 to 0.4
Tin (Sn), % 0
98.3 to 99.3
Zinc (Zn), % 0 to 1.0
0 to 0.0010
Residuals, % 0 to 0.5
0